September ’07 - Next generation PCI Express
Raza Microelectronics, Inc.announced that RMI will support the broad market attach strategy of Intel Corporation that involves using Geneseo (next generation PCI Express) technologies in the integration of RMI's XLR and XLS Processors into Intel-based products to provide unparalleled performance.
Currently the high-performance acceleration capabilities of RMI's Scalable Processor Solutions Processor families can be integrated with an Intel Platform to produce solutions providing the ultimate in features and performance. RMI will be showcasing its XLR532 PCIX-I Card as part of the "Wall of Accelerators" at the Intel Developer's Forum in San Francisco from September 17-20, 2007.
RMI's Scalable Processor Solutions are multi-core multi-threaded processors providing a rich set of features and performance to address the wide variety of integrated next generation applications, including integrated security, web services, virtualized storage, load balancing, server offload and intelligent routing and switching systems. The XLR 700 and XLR 500 series processors are software and hardware compatible and each processor is available in a variety of power options including standard, low and ultra low power.
The XLS Processor family consists of cost-effective devices for embedded communication and networking, SMB and client oriented solutions. These solutions include integrated security, access points, routers and switch products. Each device within its series is software and hardware compatible, and the XLS 600, 400, and 200 series processors are software compatible.
Today the integrated use of an Scalable Processor Solutions processor with Intel Xeon Multi-Core processors provides best of class performance in many solutions such as communications and storage applications. By taking advantage of the packet processing capabilities of the RMI Scalable Processor Solutions processor with the compute processing capabilities of the Intel processor, applications can be accelerated to a new level.
For example, IBM has used this integrated RMI/Intel architecture in their Proventia GX6116, which provides exceptional performance in network throughput while providing high-performance intrusion protection.
For future RMI Scalable Processor Solutions, the addition of Geneseo (next generation PCI Express) technologies will provide the next level in high performance. RMI will include this capability in its next generation high-end XLR Processor products, and with this, the full capabilities of the XLR Processor will be able to take advantage of the exceptional speed and low latency of the of the new interface.
"The collaboration between RMI and Intel is extremely valuable and is a strong testament to the strength of our solutions and the adoption of the XLR and XLS Processors by our customers," said Lance Smith, vice president and general manager, Scalable Processor Solutions, RMI. "This collaboration will help drive future implementations of our products and ultimately provide our customers with the solutions they need to conduct their business."
"By working with RMI, our mutual customers will be able to deploy advanced solutions available in the marketplace. We see the combined use of RMI's XLR and XLS Processors in Intel-based platforms as a way customers can deliver a scalable range of price and performance solutions, each of which provide unparalleled features and performance," said Anthony Neal-Graves, General Manager, marketing and technology solutions, Intel Corporation.
Raza Microelectronics, Inc. is a fabless semiconductor company providing highly integrated, feature-rich products ranging from power-optimized System-on-a-Chip (SoC) solutions to High-Performance Processors for the Digital Consumer, Wireless, Networking and Security markets. RMI offers the most advanced and the most complete MIPS-Based(R) processing solutions with both 32/64-bit architectures. The company is headquartered in Cupertino, CA with branch and subsidiary offices in Texas, India, Korea, Japan, Taiwan and China.
Source: Raza Microelectronics (19-9-07)
ICT professional meeting - Brussels
The International Engineering Consortium (IEC) brings its Broadband World Forum Europe 2008 at the Brussels Expo with Belgacom as the official host sponsor. The conference and exhibition takes place over four days from 29 September to 2 October.
"In collaboration with the colocated ICT Symposium, this year´s event will combine telecommunications solutions with innovations for enterprise," commented IEC President John Janowiak. "The exhibition and workshops will cover technology, business, strategic and operational issues on topics such as mobility, collaboration, security, and risk management, and address the most promising alternatives for moving forward in the ICT industry."
Themed "Delivering the Promise," the Broadband World Forum Europe 2008 will present key industry leaders at the event including World Forum Chair Scott Alcott, executive vice president of the service delivery engine at Belgacom; and Keynoters Didier Bellens, chief executive officer of Belgacom; Pat Russo, chief executive officer of AlcatelLucent; John McMahon, president and managing director of the European department at Sony Pictures Television International; CarlHenric Svanberg, president and chief executive officer of Ericsson; and Julio Linares Lopez, chief operating officer of Telefonica de España.
The event provides "a great opportunity to see what is happening, what is on the future time path, and great interaction with all of the professionals around the world," declared World Forum Chair Scott Alcott.
Continuing the tradition, this year´s InfoVision Awards will honor the most unique and beneficial technologies, applications, products, advances and services in the industry.
Sponsors for the Broadband World Forum Europe 2008 include Official Host Sponsor Belgacom, as well as Nokia Siemens Networks, Alcatel Lucent, Ericsson, Huawei, NEC, Thomson, ZTE, Italtel ADVA, Allied Telesis, Astra, AVM, Actelis, ADC, Soapstone Networks, and Cisco.
The IEC welcomes all industry professionals to attend. Register for Conference badges as well as complimentary Exhibits PLUS Passes at registration page.
12-8-08
SLTk Pro is a plug-in software for Autodesk Maya that allows users to create and export objects for Second Life. It replicates procedural objects of Second Life - called "Prim" - in Maya.
Powerful functionalities of Maya can be utilized for object creation for Second Life, that brings enormous productivity gains to users.
Product Name: SLTk Pro for Maya : A Tool Kit for Second Life
Requirement: Autodesk(R) Maya 6.5, 7.0, 8.0 and 8.5 (for Maya 2008 and 3ds Max coming soon)
Release Date: September 10, 2007
Source: Sim-Image Co. Ltd. (10-9-07)
Cantabria infinita
Cueva de El Soplao • Año Santo Lebaniego • Turismo y gastronomía
Propuestas en Brasil
Cabo Frío: paraíso a 200 km de Río • Niterói: playas, arquitectura y agenda cultural • El camino de Niemeyer: recorrido arquitectónico
Propuestas en Argentina
Ruta Nacional 40: Recorrido de la parte Norte • Recorrido del Centro (Cuyo) • Recorrido de la parte Sur (Patagonia)
Propuestas de turismo
en la Comunidad Valenciana
Ibi, Onil, Foia de Castalla • Belén de Tirisiti - Patrimonio cultural en Alcoi • Los Baños del Almirante (Valencia del s.XIV) • Mundo Naval en el museo Príncipe Felipe • Arte rupestre valenciano (Museo de la Valltorta)
Transporte aéreo
Air Nostrum • Ryanair • Spanair • Vueling